IC Packaging Design Intern

Our approach to internship is to make the successful candidate an integral part of our team. We understand that it is best to learn through direct involvement and we will provide you with tasks that enable you to learn and to be productive at the same time. The more you learn the more complex your tasks will become. The internship program is an important part of our recruiting strategy. This position is for a 12 – 16 month student IC packaging design internship at Semtech Canada with the Signal Integrity Products Group (SIP) in our Ottawa Design Centre.

Responsibilities:

As the Intern of the IC packaging design team, you will be involved with:

• Design of IC chip carriers contained in either electronic components or pluggable modules

• Using advanced CAD tools, support

  • circuit layout of mini-panels containing Semtech chips requiring a high density of high speed transmissions lines and sensitive power domains
  • physical assembly design and mechanical outlines

• Support our signal integrity experts with layout generation to accelerate 3D electromagnetic simulations as well as thermo-mechanical analysis.

• Semtech’s dynamic team environment and senior packaging engineers will provide mentoring and guidance throughout the internship term

Minimum Qualifications:

• Experience with advanced manufacturing in electronic would be a strong asset

• Ability to learn quickly and work independently or in a team environment

• Exposure to CAD tools would be an asset

  • Electrical card design tools (Cadence Allegro, Keysight ADS)
  • Mechanical design tools (Autocad, Draftsight, Solidworks)

• Basic understanding of frequency analysis, and analog electronic circuit fundamentals would be an asset

• Experience with tolerance analysis would be an asset

• Enjoying team work

• Desired start date May 2026, 12-16 month term